Method of forming a housing for an electronic device

ABSTRACT

The described embodiments relate to electronic devices. One exemplary device includes a pair of sidewall components extending between respective top portions and bottom portions, the bottom portions lying in a plane that extends between the bottom portions. The device also includes a bottom component joined with and extending between the bottom portions, wherein the bottom component has a non-loaded disposition relative to the plane and a loaded disposition relative to the plane, and wherein at least a portion of the bottom component is closer to the plane in the loaded disposition than in the non-loaded disposition.

PRIORITY

The present application is a divisional of, and claims priority to, U.S. patent application Ser. No. 10/807,628, filed on Mar. 23, 2004, now U.S. Pat. No. 7,282,640.

BACKGROUND

Electronic devices such as personal computers, servers, and digital versatile disks (DVD) players are ubiquitous in everyday life. Electronic devices can employ a housing which can define an internal volume. Various electrical components, such as processors, can be supported by the housing within the internal volume.

FIGS. 1 a-1 b illustrate an example of an electronic device. FIG. 1 a represents a front elevational view, while FIG. 1 b illustrates a perspective view. In this particular example electronic device 100 comprises a server. Electronic device 100 can comprise a housing 110. The housing can have a top component 120, a bottom component 122, first and second sidewall components 124, 126, a front component 128 and a back component, which is not specifically illustrated in these views but which can generally oppose front component 128. Sidewall components 124, 126 may extend between a top portion 134, 136 respectively which intersects top component 120, and bottom portion 138, 140 respectively which intersects bottom component 122. In these illustrated embodiments, electronic device 100 has a width w which extends between sidewall components 124, 126 and generally parallel to the x-axis, a length l which extends between front component 122 and the back component and lies generally parallel the y-axis, and a height h which extends between top component 120 and bottom component 122 and which lies generally parallel the z-axis.

FIGS. 2 a-2 c illustrate cross-sectional representations taken along the xz-plane as indicated in FIG. 1 b. FIG. 2 a illustrates housing 110 prior to loading electrical components. FIG. 2 b illustrates several electrical components 202 a-202 d within housing 110. Examples of electrical components can include, but are not limited to, processors, read only memory (ROM), random access memory (RAM), transformers, among others, and/or an assortment of such components.

In this particular embodiment bottom component 122 is supported by feet or pads 206 a, 206 b which are configured to be positioned against a supporting surface 208 which is not a component of electronic device 100.

FIG. 2 b illustrates electronic device 100 with electrical components 202 a, 202 b, 202 c, and 202 d positioned on and supported by bottom component 122. The weight of electrical components 202 a-202 d can cause at least a portion of bottom component 122 to distend or sag below the xy-plane and away from top component 120. In this instance the portion of bottom component 122 extending between pads 206 a, 206 b is sagging relative to the xy-plane. Sagging can become more pronounced with increasing electrical component densities and/or weight within a housing.

FIG. 2 c-2 d illustrate an alternative configuration where electronic device 100 is supported on bottom component 122 proximate the sidewall bottom portions 138, 140. FIG. 2 c illustrates a cross-sectional view similar to that illustrated in FIG. 2 b. FIG. 2 d illustrates a front elevational representation of a rack 230 configured to support multiple electronic devices. In this particular instance electronic device 100 can be supported by two supports 232, 234 which extend from generally opposing directions under a portion of bottom component 122. As illustrated in FIG. 2 d, support 234 extends generally horizontally from a vertical structural member 240 of rack 230.

In the configuration illustrated in FIGS. 2 c-2 d, the electrical components 202 a-202 d may cause a portion of bottom component 122, to sag from the generally planar configuration illustrated in FIG. 2 a to below the xy-plane. In this instance the portion of bottom component 122 extending between supports 232, 234 is sagging in a direction opposite top component 120 and below the xy-plane.

Sagging of an electronic device's housing can limit design parameters related to the electronic device and/or racks associated with the electronic device. For example, sagging of bottom component 122 may prevent insertion of electronic device 100 into rack 230 if such sagging causes a height dimension h₁ to exceed the allocated height dimension h₂ of rack 230.

BRIEF DESCRIPTION OF THE DRAWINGS

The same numbers are used throughout the drawings to reference like features and components wherever feasible.

FIG. 1 a illustrates a front elevation view of a prior art electronic device.

FIG. 1 b illustrates a perspective view of a prior art electronic device.

FIGS. 2 a-2 c illustrate cross-sectional views of a prior art electronic device.

FIG. 2 d illustrates a front elevational view of a prior art rack.

FIGS. 3 a-3 d illustrate cross-sectional views of a portion of an exemplary electronic device in accordance with one embodiment.

FIG. 4 a illustrates a top view of an exemplary electronic device in accordance with one embodiment.

FIGS. 4 b-4 f illustrate cross-sectional views of a portion of the exemplary electronic device illustrated in FIG. 4 a.

FIG. 5 a illustrates a top view of an exemplary electronic device in accordance with one embodiment.

FIG. 5 b illustrates a perspective view of a portion of an exemplary electronic device in accordance with one embodiment.

FIG. 6 a illustrates a top view of an exemplary electronic device in accordance with one embodiment.

FIG. 6 b illustrates a perspective view of a portion of an exemplary electronic device in accordance with one embodiment.

FIGS. 6 c-6 d illustrate cross-sectional views of a portion of the exemplary electronic device illustrated in FIG. 6 b.

DETAILED DESCRIPTION Overview

The following relates to electronic devices and housings of electronic devices. The housing comprises a bottom component joined with other components which can include sidewall components, and front wall and back wall components. When in use, electrical components can be placed in the housing and rest on the bottom component. The housing, and in particular the bottom component, can have a non-loaded disposition which, when loaded assumes a different disposition that mitigates sagging due to the weight of the electrical components contained therein.

Exemplary Embodiments

FIGS. 3 a-3 d illustrate cross-sectional views of an exemplary electronic device 100 a which can be less prone to sagging than existing designs. These cross-sectional views are taken generally parallel to the front surface of the electronic device as illustrated in relation to FIGS. 1 a-1 b and, as such, are similar to the views represented in FIGS. 2 a-2 c. FIG. 3 a illustrates a first or non-loaded configuration of electronic device 100 a. FIGS. 3 b-3 d illustrate three examples of a second or loaded configuration where electrical components are positioned in the electronic device.

Electronic device 100 a comprises housing 110 a. The housing can comprise top component 120 a and bottom component 122 a. A pair of sidewall components 124 a, 126 a extend between the top and bottom components 120 a, 122 a respectively. In this embodiment top component 120 a intersects the sidewall components at top portions 134 a, 136 a, while bottom component 122 a intersects the sidewall components at bottom portions 138 a, 140 a. The intersection of the bottom component and a sidewall component can define an edge of the bottom component. The bottom portions 138 a, 140 a can be contained in a plane extending therebetween. In this particular embodiment the plane containing the bottom portions comprises the xy-plane.

As can best be appreciated from FIG. 3 a, in the non-loaded configuration of housing 110 a, at least a portion of bottom component 122 a is deflected away from the xy-plane. In this embodiment essentially the entire bottom component 122 a extending between sidewall components 124 a, 126 a is deflected toward top component 120 a. Other exemplary configurations, examples of which are provided below, may deflect less of the bottom component.

In this particular embodiment bottom component 122 a is deflected upwardly toward the top component 120 a in a generally arcuate configuration that is concave away from top component 120 a. Examples of some other exemplary configurations are provided below. An extent of the bottom component's deflection toward top component is indicated generally here as distance z₁ which is measured generally parallel to the z-axis. Distance z₁ can have a wide range of values depending on various factors including but not limited to the width w₁ of housing 110 a, the weight of the electrical components to be positioned within the housing, and the material selected for the housing.

With present technologies, electronic devices such as servers can have a width in the range of 10 to 30 inches, though other electronic devices reside above and below this range. In some of these embodiments, distance z1 can range from 0.001 inch to 0.300 inch or more. In some exemplary configurations, with a housing width w1 of 15-20 inches, distance z1 can have a value in a range of 0.002 inch to 0.020 inch. The skilled artisan should recognize other exemplary configurations.

FIG. 3 b illustrates a representation of electrical device 100 a in the loaded configuration where electrical components 202 e, 202 f, and 202 g are positioned in housing 110 a. In this embodiment, the three electrical components 202 e-202 g are positioned in housing 110 a on bottom component 122 a. Other exemplary configurations may have more or less electrical components positioned in housing 110 a. In this embodiment, in the loaded configuration, bottom component 122 a is deflected toward the xy-plane by the weight of electrical components 202 e-202 g. As such, the bottom component's deflection away from the xy-plane, as measured generally parallel to the z-axis and indicated generally as z₂, is less in the loaded configuration than in the non-loaded configuration illustrated in FIG. 3 a.

FIGS. 3 c-3 d illustrate two alternative loaded conditions of housing 110 a. FIG. 3 c illustrates an alternative configuration where the loaded configuration causes bottom component 122 a generally to lie in the xy-plane. FIG. 3 d illustrates an alternative exemplary configuration where the loaded configuration causes bottom component 122 a generally to extend past the xy-plane to a position on the opposite side of the xy-plane as top component 120 a. In this instance the deflection of bottom component as measured generally parallel the z-axis is indicated generally as z₃. In this particular embodiment loaded deflection z₃ below the xy-plane is less than z₁ above the xy-plane. Each of the embodiments represented in FIGS. 3 b-3 d represent embodiments where the housing's bottom component is more proximate the xy-plane in the loaded configuration than in the non-loaded configuration.

FIGS. 4 a-4 f illustrate another exemplary electronic device and process steps for forming same. FIG. 4 a represents a top view while FIGS. 4 b-4 f represent cross-sectional views.

Referring to FIGS. 4 a-4 c, material 402 is processed to form a base pan 404. A base pan can comprise a bottom component and one or more adjacent components such as sidewall component(s), front wall component, and back wall component. In this particular embodiment, base pan 404 comprises bottom component 122 c and sidewall components 124 c, 126 c.

Any suitable material can be utilized to form base pan 404. In this particular embodiment, material 402 can comprise sheet metal of a gauge and composition employed in the art. Other materials such as polymers and/or other metals can also be utilized either alone or combination with sheet metal materials to form some or all of the housing components.

FIGS. 4 a-4 b illustrate material 402 with areas designated to be formed into associated components including bottom component 122 c and sidewall components 124 c, 126 c of housing 110 c. Regions of bottom component 122 b can be manipulated to define portions of the bottom component. In this embodiment two regions 410, 412 of bottom component 122 c can be manipulated to define first, second, and third portions 420, 422, and 424 of the bottom component.

FIG. 4 c illustrates base pan 404 formed by manipulating material 402 utilizing known sheet metal manipulation tools and processes such as bending and/or crimping. In some embodiments the sheet metal can be manipulated along regions 410, 412 to form an angle between the various portions 420-424. In this particular embodiment angle α is formed between first portion 420 and second portion 422. Angle β is formed between second portion 422 and third portion 424. In some embodiments angles α, β can have a value greater than 180 degrees. Some of these embodiments may utilize angles in a range of about 180.2 degrees to about 185 degrees. Other embodiments may have still larger angles α, β. For ease of describing and illustrating this embodiment, angles α, β represented in FIG. 4 c, as well as other angles in other drawings described above and below may not accurately represent the angles described in the text. In some instances the angle may be exaggerated in the illustrations to aid in explaining a related embodiment.

FIG. 4 c represents the non-loaded configuration of bottom component 122 c. In this particular embodiment, manipulated regions 410, 412 cause second portion 422 to be displaced to the same side of the xy-plane as the sidewall components 124 c, 126 c occur. This displacement can be evidenced by distance z₅.

Referring collectively to FIGS. 4 d-4 e, base pan 404 is loaded with multiple electrical components 202 i-202 p that can cause the base pan to assume the loaded configuration. FIG. 4 d illustrates an exemplary loaded configuration where the weight of the electrical components causes the bottom component's second portion to be deflected toward the xy-plane. In this embodiment in the loaded configuration second portion 422 is more proximate the xy-plane than the non-loaded configuration depicted in FIG. 4 c as can be evidenced by distance z₆ which is less than distance z₅.

FIG. 4 e illustrates an alternative loaded configuration where the weight of electrical components 202 i-202 p can cause second portion 122 to deflect toward the xy-plane when compared to the non-loaded configuration. This displacement can be evidenced by comparing distance z₇ to the greater value of z₅. In this embodiment, the weight of electrical components 202 i-202 p can also cause top portions 134 c, 136 c of sidewalls 124 c, 126 c to deflect toward bottom component 122 c forming an acute angle relative to bottom component 122 c. Angle δ₁ is illustrated between bottom component 122 c and sidewall component 126 c. In this particular embodiment, angle δ₁ is about 88 degrees. Other embodiments may have angles ranging from less than 80 degrees to more than 89.5 degrees. FIG. 4 e represents a first or unassembled flexure disposition of housing 110 c.

FIGS. 4 d-4 e represent an exemplary housing which is loaded with electrical components but is unassembled or only partially assembled. In this instance the housing's top portion has yet to be joined with base pan 404. Further process steps to assemble housing 110 c are described below.

Referring to FIGS. 4 e-4 f, top component 120 c is secured to base pan 404 to achieve a second or assembled flexure disposition of housing 110 c as evidenced in FIG. 4 f. In this instance, force as indicated generally by arrows f₁, is applied to sidewall components 124 c, 126 c so that the sidewall components extend generally parallel to the z-axis. Top component 120 c can then be secured to upper portions 134 c, 136 c to maintain the orientation of the sidewalls. Forcing the sidewall portions outward can create an upward force f₂ on bottom component 122 c. This upward force f₂ can cause portions of bottom component 122 c to be more upwardly disposed in the assembled configuration evidenced in FIG. 4 f than in the unassembled configuration evidenced in FIG. 4 e. This upward disposition can be evidenced from distance z₈ which is greater than distance z₇. In this embodiment illustrated in FIGS. 4 e-4 f, the housing's assembled flexure disposition is more flexed than the unassembled flexure disposition. The upward disposition alternatively can be evidenced in that sidewall 126 c maintains an acute angle δ₂ relative to bottom component in the assembled configuration. In this instance the angle is about 89 degrees, though other embodiments may range from about 85 degrees to about 90 degrees

FIG. 5 a-5 b illustrate another exemplary base pan 404 d. FIG. 5 a illustrates a top view of material 402 d which can be manipulated into the base pan as illustrated in the perspective view of FIG. 5 b.

In this embodiment, bottom pan 404 d comprises bottom component 122 d, sidewall components 124 d, 126 d and backside component 502. In this embodiment base pan's bottom component 122 d has two regions 410 d, 412 d that are manipulated to create portions of the bottom component. The two regions 410 d, 412 d of bottom component 122 d can be manipulated to define first, second, and third portions 420 d, 422 d, and 424 d of the bottom component. In this particular embodiment regions 410 d, 412 d extend less than bottom component's entire length l and can deflect at least some of bottom component 122 d away from the x-axis which is provided for reference purposes and is oriented similar to the orientation illustrated in FIGS. 4 b-4 f. Extending regions 410 d, 412 d along less than the entire length l may aid in manipulating or bending backside component 502 relative to bottom component 122 d.

FIG. 6 a-6 d illustrate another exemplary base pan 404 e. FIG. 6 a illustrates a top view of material 402 e which can be manipulated into the base pan as illustrated in the perspective view of FIG. 6 b. FIGS. 6 c and 6 d illustrate a slightly enlarged view of a portion of the bottom component illustrated in FIG. 6 b in the non-loaded and loaded configurations respectively.

In this embodiment bottom pan 404 e comprises bottom component 122 e, sidewall components 124 e, 126 e and backside component 502 c. Further, bottom component 122 c has three regions 410 c, 412 c, and 602 that can be manipulated to create two portions 420 e, 422 e of the bottom component. At least a first area 610 of portions 420 e, 422 e can be deflected above the xy-plane in the non-loaded configuration as can best be appreciated from FIG. 6 c. In this instance the xy-plane passes through the intersection of sidewall components 124 e, 126 e and back wall component 502 e with bottom component 122 e. This is but one embodiment where areas of the bottom component deflected above the xy-plane in the non-loaded configuration can contribute to reducing sagging of other or second areas of the bottom component in the loaded confirmation. For example, as illustrated in FIGS. 6 c and 6 d which illustrate non-loaded and loaded configurations respectively, area 610 of portions 420 e, 422 e can reduce sagging of second area 612 in the loaded configuration.

In this embodiment, regions 420 e, 422 e extend generally parallel to back wall 502 e. Examples of such regions extending generally parallel to the sidewalls are described above. Still further embodiments may utilize other orientation or combinations of orientations. For example, such regions can extend diagonally from a front corner of the bottom component to an opposing rear corner. The skilled artisan should recognize other embodiments.

In some embodiments portions of material 402 e can be removed to aid in manipulation of the various base pan components to one another. For example as evidenced from FIGS. 6 a-6 b, in this particular embodiment two portions 620 a, 620 b of material 402 c can be removed prior to manipulating the sidewall components 124 c, 126 c relative to bottom component 122 c to aid in the manipulation process. Removing portions 610 a, 610 b proximate an intersection of regions 420 e, 422 e and sidewall components 124 e, 126 e can aid in allowing sidewall components 124 e, 126 e to be oriented as desired relative to bottom component 122 e.

CONCLUSION

The various embodiments described above can mitigate sagging effects caused by loading various housings with electrical components.

Although the inventive concepts have been described in language specific to structural features and/or methodological steps, it is to be understood that the inventive concepts in the appended claims are not limited to the specific features or steps described. Rather, the specific features and steps are disclosed as forms of implementing the inventive concepts. 

1. A method comprising: manipulating a material to form a bottom component of a server housing, wherein the bottom component has a first edge and a least a second edge and wherein the first and second edges lie in a plane; and, manipulating at least a region of the bottom component to cause a portion wherein the portion comprises a central portion, of the bottom component to be upwardly deflected away from the plane such that positioning electrical components on the bottom component will cause the portion to deflect downwardly toward the plane, wherein the manipulating a material comprises forming a first sidewall that collectively defines the first edge with an intersecting first portion of the bottom component and forming a second sidewall that collectively defines the second edge with an intersecting second portion of the bottom component; wherein the acts of manipulating cause the first sidewall and the first portion and the second sidewall and the second portion to define acute angles therebetween.
 2. The method as recited in claim 1, wherein the manipulating at least a region comprises one or more of bending, forming, and crimping the at least a region.
 3. The method as recited in claim 1, wherein the manipulating at least a region comprises manipulating a single generally linear region that lies parallel to and equidistant from the first and second edges.
 4. The method as recited in claim 3, wherein the manipulating a single generally linear region comprises manipulating the region along an entire length of the bottom component as defined by the first and second edges.
 5. The method as recited in claim 3, wherein the manipulating a single generally linear region comprises manipulating the region along an entire width of the bottom component as defined between the first and second edges.
 6. The method as recited in claim 1, wherein the manipulating at least a region comprises manipulating two generally linear regions that lie parallel to the first and second edges and which generally define the portion therebetween.
 7. The method as recited in claim 1, wherein the manipulating at least a region comprises manipulating two linear region that are generally parallel to the first and second edges.
 8. The method as recited in claim 1, wherein the manipulating at least a region comprises manipulating two linear regions that are generally perpendicular to the first and second edges.
 9. A method of forming a housing for an electronic device, comprising: manipulating a material to form a bottom component of the housing, wherein the bottom component has a first edge and a least a second edge and wherein the first and second edges lie in a plane; and, manipulating at least a region of the bottom component to cause a portion, wherein the portion comprises a central portion, of the bottom component to be upwardly deflected away from the plane such that positioning electrical components on the bottom component will cause the portion to deflect downwardly toward the plane, wherein the manipulating the material comprises forming a first sidewall that collectively defines the first edge with an intersecting first portion of the bottom component and forming a second sidewall that collectively defines the second edge with an intersecting second portion of the bottom component; wherein the acts of manipulating cause the first sidewall and the first portion and the second sidewall and the second portion to define acute angles therebetween.
 10. The method as recited in claim 9, wherein the manipulating at least a region comprises manipulating a single generally linear region that lies parallel to and equidistant from the first and second edges.
 11. The method as recited in claim 10, wherein the manipulating a single generally linear region comprises manipulating the region along an entire length of the bottom component as defined by the first and second edges.
 12. The method as recited in claim 10, wherein the manipulating a single generally linear region comprises manipulating the region along an entire width of the bottom component as defined between the first and second edges.
 13. The method as recited in claim 9, wherein the manipulating at least a region comprises manipulating two generally linear regions that lie parallel to the first and second edges and which generally define the portion therebetween.
 14. The method as recited in claim 9, wherein the manipulating at least a region comprises manipulating two linear region that are generally parallel to the first and second edges.
 15. The method as recited in claim 9, wherein the manipulating at least a region comprises manipulating two linear regions that are generally perpendicular to the first and second edges.
 16. A method of forming a housing for an electronic device, comprising: bending a material to form a bottom component of the housing, wherein the bottom component has a first edge and a least a second edge and wherein the first and second edges lie in a plane; and, bending at least a region of the bottom component to cause a portion, wherein the portion comprises a central portion, of the bottom component to be upwardly deflected away from the plane such that positioning electrical components on the bottom component will cause the portion to deflect downwardly toward the plane, wherein the bending the material comprises forming a first sidewall that collectively defines the first edge with an intersecting first portion of the bottom component and forming a second sidewall that collectively defines the second edge with an intersecting second portion of the bottom component; wherein the acts of bending cause the first sidewall and the first portion and the second sidewall and the second portion to define acute angles therebetween.
 17. The method as recited in claim 16, wherein the bending at least a region comprises bending a single generally linear region that lies parallel to and equidistant from the first and second edges.
 18. The method as recited in claim 16, wherein the bending at least a region comprises bending two generally linear regions that lie parallel to the first and second edges and which generally define the portion therebetween.
 19. The method as recited in claim 16, wherein the bending at least a region comprises bending two linear region that are generally parallel to the first and second edges.
 20. The method as recited in claim 16, wherein the bending at least a region comprises bending two linear regions that are generally perpendicular to the first and second edges. 